Overview

VVDN has designed and developed QCM6490 SOM based on the Qualcomm® Snapdragon™ SoC QCM6490. The SOM supports rich interfaces for connectivity including global 5G mmW/Sub-6 GHz, Wi-Fi 6E (802.11ax), Bluetooth 5.2 and other rich peripherals including Four 4 lane MIPI CSI for cameras, One 4 lane MIPI DSI for display, USB 3.1, USB 2.0 etc. The SOM provides rich hardware interfaces and software SDKs for building quick prototype development and validating functions easily.

TECHNICAL SPECIFICATIONS:

Platform
  • Snapdragon™ QCM6490
CPU
  • Qualcomm® Kryo™ 670 CPU
  • QCS6490 Gold+ (2.7 GHz); Gold (3x 2.4 GHz); Silver (4x 1.9 GHz)
GPU
  • Adreno GPU 643
Memory
  • 8GB LPDDR4X+128GB UFS2.2(uMCP)
Connectivity
  • Sub-6 GHz 5G NR
  • WLAN: Wi-Fi 6E (802.11ax)
  • Bluetooth® 5.2
Band Support(5G/4G)
  • EMEA:
    5G SA/NSA: n1/3/5/7/8/20/28/38/40/41/77/78/79
    LTE: B1/2/3/4/5/7/8/12/17/18/19/20/26/28/32/34/38/39/40/41/42
  • NA
    5G SA/NSA: n2/5/7/12/13/14/25/26/29/30/38/41/48/66/70/71/77/78
    LTE: B2/4/5/7/12/13/14/17/25/26/29/30/38/41/42/43/46/48/66/71
Camera Interfaces
  • MIPI-CSI: 4x 4-lane CSIs (4/4/4/4 ) support , 36 + 22 MP at 30 fps/3x22 MP 30 fps ZSL
Display Interfaces
  • MIPI-DSI: One 4-lane DSI D-PHY
  • Type-C with Display Port v1.4
Video Performance
  • Up to 4K30 encode for H.264/H.265
  • Up to 4K60 decode for H.264/H.265/VP9
Audio Interfaces
  • 2x Soundwire, 2x DMIC, MI2S
Other Interfaces
  • 1x PCIe Gen 3 1-lane for Wi-Fi/BT internal
  • 1x PCIe Gen 3 2-lane for external
  • 1x USB 3.1 Type C
  • 1x USB 2.0
  • SD v3.0 4 bit for SD interface
  • UART, I2C, SPI, I3C, GPIOs
OS
  • Linux
Form factor
  • 60mm X 60mm
Carrier Board Interface
  • 2x 180 Pin B2B connector

TARGETED APPLICATIONS

Ruggedized Handhelds
Ruggedized Handhelds
Industrial Scanners
Industrial Scanners
Point of Sale (POS)
Point of Sale (POS)
Dash Cameras
Dash Cameras
Human-machine Interface Systems
Human-machine Interface Systems
Tablets
Tablets
5G Cameras
5G Cameras

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