VVDN-QCS8250 Development Kit Based on QCS 8250

5G
Networking and Wi-Fi
Internet of Things
Vision
Cloud and Applications

Overview

QCS 8250 development kit latest offering from VVDN is a powerful compact solution for edge computing applications. The QCS 8250 development kit comprises of SOM (based on Qualcomm®’s QCS8250 IoT Octa-core SoC) and Carrier Board designed and developed by VVDN. The SOM provides multiple standard interfaces such as UART, I2C, SPI, configurable GPIOs, CAN, USB 3.1. It can support multiple cameras with six 4-lane MIPI CSI and two 4-lane MIPI DSI

The system is intended for kickstarting the development of applications that requires intelligent processing including connected cameras, Video collaboration, retail self checkout, AR/VR, health care, fleet management, Digital signage and other AI applications on the edge.

Highlighted Features

Powerful specialized processing cores based SOM
Android 10 based OS
Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
Dedicated computer vision engine
Multiple interfaces options for connectivity, camera, and Display
Ultra compact form factor

*Mechanical enclosure option is also available alongside development kit.

Processor	QCS8250
Display Interface	2x 4-lane MIPI DSI D-PHY 1.2, up to 4K @ 60 Hz
Camera Interface	6x 4-lane MIPI CSI Qualcomm® Spectra™ 480 image signal processor
Memory	8GB LPDDR5 + 128GB UFS
Video Performance	QCS 8250 - Encode: 8K30/4K120 Decode: 8K60/4K240
Wi-Fi	WLAN 2 x 2 802.11ax with DBS (QCA6391)
Bluetooth	Bluetooth 5.1
Sensor Core Interface	SPI, I2C, GPIO
I/O Interface	2x240 pin board to board connector
OS	Android 10
Form Factor	L 52mm x W 52mm

Interface with SOM	2x 240 pins B2B Connector
Camera	6 x MIPI CSI (4 Lanes)
Ethernet	RJ45 (10/100/1000Mbps)
USB Connectivity	1X USB 3.1 Type C with Display port 2X USB 2.0 Type A (Host Only)
Storage	Micro SD card Connector
Display interfaces	1x MIPI DSI for HDMI Out / Display connectivity
I/O Interface	UART, I2C, SPI, configurable GPIOs, CAN provision, Additional GPIO header
M.2 connector	For 4G/5G Module (PCIe/USB Interface)
Power In	12V DC
Audio out/In	3.5mm Head Phone Jack with Mic option 6 microphone, stereo speaker (upto 4W)
Debug	Debug console through Micro USB
Form factor	L 170 mm x W 132mm

*Qualcomm QCS8250 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

TARGETED APPLICATIONS

QCS8250 SOM compact size and features make it the best to facilitate a cost-effective and efficient system to which next-gen camera modules can be interfaced for various AI-based applications: